Micromechanical semiconductor component and manufacturing method therefor

US5760455A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Christofer Hierold · Munich, DE
• Thomas Scheiter · Munich, DE
• Markus Biebl · Augsburg, DE
• Helmut Klose · Munich, DE

Key dates

• Filing date: Mar 15, 1996
• Grant date: Jun 2, 1998
• Expiry date: Mar 15, 2016

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0742
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A component having a movable micromechanical function element arranged in a cavity having a cover layer supported by webs or pillar-like supports is provided. The movable element is potentially covered with a termination layer for closing the etching holes present in the cover layer. Electrical terminals of the movable part, the cover layer and doped regions produced in the substrate as a cooperating electrode enable the realization of an acceleration sensor that is easy to mount in a housing.