Sensors for a linear polisher
US5762536A · kind A · utility
115Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1997 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Feb 6, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when a linear polisher is utilized to polish the wafer. The sensors are distributed along the surface or are coupled to openings along the surface to monitor the on-going polishing process. The sensed information from the sensors are processed in order to provide feedback for compensating the fluid dispensing when fluid platens are used and/or the downforce exerted by the wafer carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.