Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations
US5781413A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A technique is disclosed for forming a chip cube from a plurality of chips laminated together in front-to-back relationship, the edges of the chip forming a cube face having a set of connectors for each chip thereon. A number "X" of functional chips is required for the operation, and "X+Y" is the number of chips provided in the stack such that there is Y number of chips greater than the number of functional chips required. If any number of chips equal to Y or less are found to be defective, there are enough chips remaining to perform the required function. Thereafter X number of good chips are connected to output circuitry through an interposer. Electrical connectors are provided on all of the IC chips. Contact pads for all of the connectors are provided on one face, and outlet pads are provided on the opposite face of the interposer for at least Y number of outlets. The interposer has vias at least equal to the number of outlet pads. After assembly, the chips are burnt-in, and if there are enough functional chips after burn-in, the interposer is wired to connect X number of sets of chip pads and the outlet pads through the vias. The chip stack is mounted on the interposer wherein …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.