Microlithographic structure with an underlayer film containing a thermolyzed azide compound
US5783361A · kind A · utility
7Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1997 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Feb 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/168
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Microlithographic methods for the use of improved underlayers for chemically amplified deep UV photoresist compositions and structures produced thereby are disclosed. The compositions comprise, in admixture, a polymeric binder, and an azide which is thermolyzed during microlithographic processing to form an amine. Films formed from the underlayer compositions of the present invention, when applied immediately under and proximate to a chemically amplified photoresist film reduce the resist structure sidewall foot or undercut caused by an adverse contact reaction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.