Plasma processing method, plasma processing apparatus, and plasma generating apparatus
US5783492A · kind A · utility
31Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1995 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Mar 3, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plasma processing method of performing plasma processing such as plasma film formation processing on a target object arranged in a processing vessel is disclosed. This method includes the first step of introducing an inert gas into the processing vessel, the second step of generating a plasma of the inert gas in the processing vessel, the third step of introducing a processing gas for processing the target object into the processing vessel, and the fourth step of generating a plasma of the processing gas in the processing vessel to process the target object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.