Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems
US5786705A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1996 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Nov 14, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2858
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substantially constant current is conducted in a first direction through an interconnect structure having a barrier layer to determine the lifetime of the structure in the first current direction. A substantially identical current is conducted in a second direction through a substantially identical interconnect structure to determine the lifetime of the structure in the second current direction. These tests are repeated for identical structures but having different barrier layer thicknesses. The results of these lifetime tests are compared to determine the barrier layer's effect on electromigration in the structure, which can be used to design the barrier layer to optimize the structure's lifetime and speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.