Van-Hung Pham
8Patents
5h-index
9Co-inventors
52Inventor score
Filing activity: Dec 1, 1994 → Jul 21, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6329831A | Method and apparatus for reliability testing of integrated circuit structures and devices | Physics | 20 | Expired |
| US6075293A | Semiconductor device having a multi-layer metal interconnect structure | Electricity | 15 | Expired |
| US5786705A | Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems | Physics | 13 | Expired |
| US6100101A | Sensitive technique for metal-void detection | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5612627A | Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems | Physics | 5 | Expired |
| US6770847B2 | Method and system for Joule heating characterization | Physics | 4 | Expired |
| US8022716B2 | Dielectric breakdown lifetime enhancement using alternating current (AC) capacitance | Physics | 1 | Active |
| US8501504B2 | Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.