Patent · US Expired

Micromechanical semiconductor components and manufacturing method therefor

US5834332A · kind A · utility

14Cited by

7References

8Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Christofer Hierold · Munich, DE
Thomas Scheiter · Munich, DE
Markus Biebl · Augsburg, DE
Helmut Klose · Munich, DE

Key dates

Filing date	Sep 23, 1997
Grant date	Nov 10, 1998
Priority date	—
Expiry date	Sep 23, 2017

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0742
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A component having a movable micro mechanical function element arranged in a cavity having a cover layer supported by webs or pillar-like supports is provided. The movable element is potentially covered with a termination layer for closing the etching holes present in the cover layer. Electrical terminals of the movable part, the cover layer and doped regions produced in the substrate as a cooperating electrode enable the realization of an acceleration sensor that is easy to mount in a housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.