Lead end grid array semiconductor package
US5866939A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Dec 31, 1996 |
| Grant date | Feb 2, 1999 |
| Priority date | — |
| Expiry date | Dec 31, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a grid array type lead frame having a plurality of leads classified into groups by length forming a lead end grid array semiconductor package. The leads extend to respective lead ends, in each of which at least one different plane direction-converting lead part and/or at least one identical plane direction-converting lead part is formed by at least one bending part, whereby the lead ends are distributed in a grid array. The invention includes a lead end grid array semiconductor package employing the grid array type lead frame, which is as small as or similar to that of semiconductor chip in area while the lead ends are arrayed on one plane, farther distant way from neighboring ones but in a higher number per area, in such a manner that they form a grid array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.