Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing
US5871390A · kind A · utility
59Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1997 |
| Grant date | Feb 16, 1999 |
| Priority date | — |
| Expiry date | Feb 6, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention describes an apparatus and method for aligning a pad/belt on a roller for use in chemical mechanical polishing using linear planarization. The present invention comprises an alignment sensor that senses the alignment of the pad/belt. The present invention additionally comprises a tensioner that tensions the pad/belt on the roller. And, a controller that controls the alignment of the pad/belt on the roller by controlling the tensioner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.