Apparatus and method for double-sided polishing semiconductor wafers
US5914053A · kind A · utility
22Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1996 |
| Grant date | Jun 22, 1999 |
| Priority date | — |
| Expiry date | Nov 14, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In double-side polishing of semiconductor wafers, not only the two main surfaces but also the surface of the edge portion can be polished in one operation with cost reduction and freedom from contamination. An apparatus with twin polishing turn tables is used in the double-side polishing and the inner peripheral edge of each carrier hole formed in a wafer carrier is profiled such that the sectional profile of the inner peripheral edge is substantially the copy of the edge of the wafer placed in the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.