Method for producing a semiconductor device
US5930603A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | May 27, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0376
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a semiconductor device includes steps of: a) a positioning board forming process in which concave portions, each of which is located at a position corresponding to a position of a respective projecting electrode of a semiconductor device, and first positioning portions, which are used for determining a position of a sealing resin with respect to the projecting electrode, are integrally formed on a flat-plate member so as to form a positioning board; b) a filling process in which an electrode material for forming the projecting electrode is filled in the concave portions formed on the positioning board; c) a bonding process in which a composite board is formed by mounting a circuit board on the positioning board so as to bond each of the electrode material filled in the concave portions to the circuit board; d) a sealing resin forming process in which a mold having a cavity for forming a sealing resin and second positioning portions for determining a position of the positioning board with respect to the cavity is fixed to the composite board in a state that the position of the positioning board is determined with respect to the cavity by engaging the first pos…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.