Multiple pole electrostatic chuck with self healing mechanism for wafer clamping
US5953200A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 1998 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Feb 5, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck device for clamping a semiconductor wafer substrate during processing of the semiconductor wafer includes a power source, at least one negative pole, and a plurality of positive poles. Each positive pole selected from the plurality of positive poles is electrically separated from the negative pole. Also provided is a plurality of fuses, each fuse of the plurality of fuses is coupled to an associated positive pole included in the plurality of positive poles. Each fuse is further coupled to the power source. In some embodiments, each positive pole is electrically separated from the negative pole by an insulating epoxy. In other embodiments, the plurality of positive poles are connected to each other in parallel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.