Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps
US5962921A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1997 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Mar 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An interconnect for establishing temporary electrical communication with semiconductor dice, or packages, having contact bumps is provided. The interconnect includes patterns of contact members adapted to receive the contact bumps. Each contact member includes a recess covered with a conductive layer in electrical communication with a conductor. The recesses include a peripheral edge sized to contact a range of bump sizes and to penetrate native oxide layers on the bumps. In addition, the contact members can include blades configured to penetrate into the bumps. The interconnect can be employed in a wafer level test system for testing dice contained on a wafer, or in a die level test system for testing bare dice or chip scale packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.