Pulse electroplating copper or copper alloys
US5972192A · kind A · utility
225Cited by
20References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1997 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Jul 23, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
High aspect ratio openings in excess of 3, such as trenches, via holes or contact holes, in a dielectric layer are voidlessly filled employing a pulse or forward-reverse pulse electroplating technique to deposit copper or a copper-base alloy. A leveling agent is incorporated in the electroplating composition to ensure that the opening is filled substantially sequentially from the bottom upwardly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.