Multi-zone gas injection apparatus and method for microelectronics manufacturing equipment
US5976261A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 1996 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Jul 11, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45565
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for multi-zone injection apparatus of multiple process gases onto a work piece during manufacture. The multi-zone injection apparatus uses a gas injection plate with multiple injection zones to deliver the multiple process gases into the chamber for deposition onto the work piece (for example, a silicon wafer). The gas showerhead separates the multiple process in a manner that avoids premixing the process gases, thereby minimizing gas-phase nucleation and particulate generation. The showerhead also allows real-time independent control over the gas flow rates in N channels to achieve deposition uniformity. Different gases can be configured in adjacent channels to provide M zones of multi-gas radial control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.