Method and apparatus for fabricating semiconductor devices
US5981399A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Aug 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67748
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device fabrication apparatus having multiple processing chambers for different processes, where a substrate is carried in and out in a sophisticated manner, with their different internal ambient conditions being retained, so that the substrate is free from contamination, thereby manufacturing high-quality semiconductor devices at high throughput. The apparatus includes a movable buffer chamber having a wafer carriage means within a transfer chamber which faces a process chamber, an evacuation means which evacuates of gas the buffer chamber, transfer chamber and process chamber independently, a gas feed means, and a control means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.