Flux cleaning for flip chip technology using environmentally friendly solvents
US5988485A · kind A · utility
15Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1998 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Mar 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90.degree. C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.