Semiconductor wafer processing system with immersion module

US5996241A · kind A · utility

Assignee

• Semitool, Inc. · US

Inventors

• Raymon F. Thompson · Kalispell, US
• Robert W. Berner · Kalispell, US
• Gary L. Curtis · Kila, US
• Stephen P. Culliton · Kalispell, US
• Blaine G. Wright · Whitefish, US

Key dates

• Filing date: Mar 7, 1997
• Grant date: Dec 7, 1999
• Expiry date: Mar 7, 2017

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S414/141
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.