Method of making a printed circuit board having filled holes
US6009620A · kind A · utility
29Cited by
37References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1998 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Jul 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a circuitized substrate wherein fill material is forced into the substrate's holes to thus provide additional support for conductive circuitry or the like thereon, thus increasing the final product's circuit density. The fill is provided in a substantially uncured state, following which partial cure occurs. Thereafter, the fill is substantially fully cured and the aforementioned circuit elements may then be provided directly thereon. Alternatively, a dual fill process is used with both quantities of uncured fill being disposed in each hole and then cured by a singular UV exposure step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.