Elevated pin diode active pixel sensor including a unique interconnection structure

US6018187A · kind A · utility

Assignee

• Hewlett-Packard Company, L.P. · US

Inventors

• Jeremy Alfred Theil · Mountain View, US
• Min Cao · Hsinchu, TW
• Dietrich W. Vook · Los Altos, US
• Frederick Perner · Palo Alto, US
• Xin Sun · Shenyang, CN
• Shawming Ma · Sunnyvale, US
• Gary W. Ray · Mountain View, US

Key dates

• Filing date: Oct 19, 1998
• Grant date: Jan 25, 2000
• Expiry date: Oct 19, 2018

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/548

Abstract

An active pixel sensor. The active pixel sensor includes a substrate, an interconnect structure adjacent to the substrate, and at least one photo sensor adjacent to the interconnect structure. Each photo sensor includes an individual pixel electrode. An I-layer is formed over all of the pixel electrodes. A transparent electrode is formed over the I-layer. An inner surface of the transparent electrode is electrically connected to the I-layer and the interconnect structure.