Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
US6022759A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Feb 18, 1998 |
| Grant date | Feb 8, 2000 |
| Priority date | — |
| Expiry date | Feb 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.