Semiconductor package with wire bond protective member
US6025728A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1997 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Apr 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A package, system and method for testing semiconductor dice are provided. The package include a base for retaining the die, and an interconnect having contact members for establishing temporary electrical connections with the die. Electrical paths are formed between terminal contacts on the base, and the contact members on the interconnect, by wires that are wire bonded to conductors on the base and interconnect. The package includes a protective member for protecting the wires and associated wire bonds during assembly, disassembly and handling of the package. The protective member can be formed as a plate mounted to the base and configured to cover the wires and wire bonds. Alternately the protective member can comprise an encapsulating material such as an epoxy resin or silicone elastomer deposited on the wires and wire bonds and then cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.