"Sockets for ""springed"" semiconductor devices"
US6033935A · kind A · utility
115Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1998 |
| Grant date | Mar 7, 2000 |
| Priority date | — |
| Expiry date | Jun 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.