Ultra-high vacuum apparatus and method for high productivity physical vapor deposition.
US6039848A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1997 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Oct 27, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A magnetron sputtering system is provided that uses a backing plate assembly having an insulating spacer ring coupled between and hermetically sealed to the backing plate and an extender ring. The insulating spacer ring can be constructed from a ceramic material, and the extender ring can be constructed from a metal material. The use of this backing plate assembly allows the backing plate assembly to be coupled directly to the chamber walls with a metal-to-metal contact, while the backing plate remains electrically isolated from the chamber walls. This allows the sealing of a vacuum chamber in the magnetron sputtering system using a seal suitable for creating an ultra-high vacuum in the vacuum chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.