Apparatus for and method of cleaning objects to be processed
US6045624A · kind A · utility
24Cited by
15References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1997 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Sep 24, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cleaning apparatus and a cleaning method for restricting an occurrence of water marks on a surface of a object to be processed are provided. The cleaning apparatus is constructed so as to dry wafers W, which have been rinsed by DIW in a drying chamber 42, in a cooling system. Thus, the reaction between, for example, IPA, DIW etc. and silicon in surfaces of the wafers W is inactivated to cause the surfaces to be oxidized with difficulty, so that it is possible to restrict the occurrence of the water marks on the surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.