Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulse
US6053802A · kind A · utility
4Cited by
2References
4Claims
0Family size
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Key dates
| Filing date | Jun 3, 1999 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Jun 3, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/91
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for conditioning a slurry used in a chemical mechanical polishing apparatus is disclosed. Megasonic generators are provided along the piping network between a slurry reservoir and the CMP apparatus. A megasonic generator may also be placed adjacent to the slurry reservoir. The megasonic generators discourage the formation of agglomerate particles, which in turn reduces the number of defects caused by the large particles in the slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.