Method for aligning a wafer
US6063440A · kind A · utility
11Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 1997 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Jul 11, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for aligning a wafer on a support member within a vacuum chamber includes increasing the pressure within the vacuum chamber to at least about 1 Torr before aligning the wafer. The wafer is introduced into the vacuum chamber on the support member, the pressure is increased to at least about one Torr, and the support member is lifted into a shadow ring that has a frustoconical inner cavity constructed to funnel the wafer to a centered, aligned position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.