Method to minimize particulate induced clamping failures
US6066546A · kind A · utility
1Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 1999 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Jan 8, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor wafer in a chamber having a chuck and in which temperature changes in the chamber cause residual manufacturing materials to fall onto the surface of a production wafer placed on the chuck. When the temperature of the chamber is to be changed, a protection wafer is placed on the surface of the chuck. When the temperature has been changed, the protection wafer is removed from the surface of the chuck and a production wafer is placed on the surface of the chuck and clamped. When the process is complete the production wafer is removed and the protection wafer is placed on the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.