Multi-part lead frame with dissimilar materials and method of manufacturing
US6072228A · kind A · utility
173Cited by
8References
73Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1996 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Oct 25, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-leadframe die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi part lead frame may be dissimilar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.