Device having resin package with projections
US6072239A · kind A · utility
161Cited by
14References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1996 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Nov 6, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.