Temporary package, and method system for testing semiconductor dice having backside electrodes
US6072323A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1997 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Mar 3, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temporary package, a method, and a system for testing a semiconductor die having a backside electrode are provided. The temporary package includes a base for retaining the die; a conductive member for electrically contacting the backside electrode on the die; and terminal contacts in electrical communication with the conductive member. The package also includes a force applying mechanism for biasing the conductive member against the backside electrode. A conductive path between the conductive member and terminal contacts can be through a wire, or through the force applying mechanism. In an alternate embodiment the temporary package includes a base and terminal contacts formed in the configuration of a conventional semiconductor package. A cover for the base can include a metal, carbon filled elastomer, conductive foam, or conductive adhesive conductive member. The conductive member can be adapted to simultaneously contact the backside electrode on the die, and a mating contact on the base in electrical communication with the terminal contact. In addition, the conductive member can function as a heat sink for cooling the die during the test procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.