Method and apparatus for surface-grinding of workpiece
US6077149A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1997 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Oct 17, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/068
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a surface-grinding method for a workpiece, for example a semiconductor wafer, it is possible to correct or improve waviness and bow and to obtain a semiconductor wafer having no thickness dispersion. Besides, wafer processing to higher precision than that conventionally attained is achieved and at the same time simplification of the processing method and thereby reduction of the cost are also achieved. In the present invention, while the workpiece is fixed for supporting at one surface by the fixedly supporting means of a surface-grinding apparatus, the other surface of the workpiece is surface-ground, where the workpiece adheres on the upper surface of a base plate by the aid of adhesive material and the base plate is fixedly supported by the lower surface of itself on the fixedly supporting means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.