Automated brush fluxing system for application of controlled amount of flux to packages
US6098867A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1998 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Mar 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4864
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.