Apparatus and method for controlling polishing of integrated circuit substrates
US6102776A · kind A · utility
7Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1999 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Jan 6, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for polishing a surface. The surface is positioned in contact with a rotating table having a polishing slurry or compound applied to a table surface. The pattern formed in the polishing compound as the table is rotated is monitored, and when the pattern dimensions reach a predetermined size, indicating a polished end point, the polisher ends polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.