Electroplating uniformity by diffuser design
US6103085A · kind A · utility
72Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1998 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Dec 4, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/008
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Workpieces, such as semiconductor wafers, are electroplated with improved thickness uniformity by providing a diffuser member intermediate the cathode and anode of a fountain-type electroplating apparatus. The diffuser or member has a pattern of openings specifically designed to prevent channeling and/or selective directing of electrolyte towards the workpiece. In one embodiment, the diffuser member comprises a spiral-shaped pattern of openings originating at the center of the diffuser member and extending to the periphery thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.