Polishing pad having a wear level indicator and system using the same
US6106661A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 1998 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | May 8, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad having a wear level indicator and a polishing system employing the same is provided. A polishing pad, in accordance with one embodiment of the invention, includes a pad structure and an indicator, disposed in the pad structure, indicating the wear level of the pad structure. The pad structure may, for example, include a top pad and a bottom pad with the indicator being disposed in the top pad. The wear level may, for example, be a critical thickness of the polishing pad which indicates the end of the pad lifetime or which indicates the need to change polishing processing. The use of a wear level indicator allows for efficient and reliable pad wear level indication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.