Process for reconditioning polishing pads
US6120350A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1999 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Mar 31, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad shaping tool for shaping a polishing pad. The tool includes a disk having a first side and a second side and at least two discontinuous pad shaping surfaces located in spaced apart positions relative to each other on the first side of the disk. The pad shaping surfaces are simultaneously engageable with a polishing surface of the polishing pad for shaping the polishing surface as the pad rotates relative to the tool to change a cross sectional profile of the polishing surface from a curved shape to a flatter shape. A process for reconditioning the polishing pad on a rotatable platform of a wafer polishing machine includes the steps of engaging the pad shaping tool with the polishing surface of the pad such that at least two discontinuous pad shaping surfaces of the tool simultaneously engage the polishing surface, and rotating the polishing pad while preventing translational movement of the tool relative to the pad so that the tool shapes the polishing surface of the pad to be more nearly flat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.