Eugene C. Davis
9Patents
3h-index
27Co-inventors
57Inventor score
Filing activity: Jan 19, 1993 → Aug 31, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5424224A | Method of surface protection of a semiconductor wafer during polishing | Emerging Cross-Sectional Technologies | 18 | Expired |
| US7899571B2 | Predictive method to improve within wafer CMP uniformity through optimized pad conditioning | Performing Operations; Transporting | 10 | Active |
| US6120350A | Process for reconditioning polishing pads | Performing Operations; Transporting | 8 | Expired |
| US8334190B2 | Single step CMP for polishing three or more layer film stacks | Electricity | 1 | Active |
| US11742208B2 | Method of reducing voids and seams in trench structures by forming semi-amorphous polysilicon | Electricity | 1 | Active |
| US8172647B2 | Polish pad conditioning in mechanical polishing systems | Performing Operations; Transporting | 0 | Active |
| US11081558B2 | LDMOS with high-k drain STI dielectric | Electricity | 0 | Active |
| US12087813B2 | Deep trench isolation with field oxide | Electricity | 0 | Active |
| US10593773B2 | LDMOS with high-k drain STI dielectric | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.