Semiconductor processing methods, and methods of forming capacitors
US6127239A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1999 |
| Grant date | Oct 3, 2000 |
| Priority date | — |
| Expiry date | Jul 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one aspect, the invention includes: a) forming a first opening into a substrate surface; b) forming a polysilicon layer over the substrate surface and within the first opening to a thickness which less than completely fills the first opening to leave a second opening within the first opening; c) forming a coating layer over the polysilicon layer and within the second opening; d) etching the coating layer and the polysilicon layer to remove the coating layer and the polysilicon layer from over the substrate surface and leave the coating layer and the polysilicon layer within the opening; and e) after the etching, removing the coating layer from within the opening. In another aspect, the invention includes: a) forming a first opening into a substrate surface; b) forming a polysilicon layer over the substrate surface and within the first opening to a thickness which less than completely fills the first opening to leave a second opening within the first opening, the polysilicon having a surface with a first degree of roughness; c) forming a coating layer over the polysilicon layer and within the second opening, the coating layer having a surface with a second degree of roughness whi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.