Carrier head with local pressure control for a chemical mechanical polishing apparatus
US6146259A · kind A · utility
53Cited by
22References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1997 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Aug 8, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the purpose.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.