Polishing machine
US6146260A · kind A · utility
8Cited by
5References
7Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Aug 3, 1998 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Aug 3, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer adapter for a chemical and mechanical polishing (CMP) machine. The adapter includes a retaining ring with multiple grooves formed on one surface of the ring and an inner circle for grasping just a wafer. The grooves have narrower openings at the outer and wider bottoms at the inner circle of the ring. The bottoms are apart from the inner circle with a circular wall. The adapter with wedged grooves served as slurry pools has been proved to have higher polishing efficiency, no wafer lose by sharp edges collision on the wall and less contact pressure between the wafer and the adapter to extend the lifetime of the adapter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.