Patent assignee · TW · COMPANY

ProMOS Technology, Inc.

17Patents
0Active
17Granted
33Portfolio score

Filing activity: Aug 3, 1998 → Aug 17, 2004

Most-cited patents

PatentTitleAreaCited byStatus
US6306772A Deep trench bottle-shaped etching using Cl2 gas Electricity 172 Expired
US6440792B1 DRAM technology of storage node formation and no conduction/isolation process of bottle-shaped deep trench Electricity 45 Expired
US6232171A Technique of bottle-shaped deep trench formation Electricity 35 Expired
US6495411B1 Technique to improve deep trench capacitance by increasing surface thereof Emerging Cross-Sectional Technologies 29 Expired
US6365485B1 DRAM technology of buried plate formation of bottle-shaped deep trench Electricity 29 Expired
US6071823A Deep trench bottle-shaped etch in centura mark II NG Electricity 21 Expired
US6291286A Two-step strap implantation of making deep trench capacitors for DRAM cells Electricity 20 Expired
US6083787A Method of fabricating deep trench capacitors for dram cells Electricity 9 Expired
US6146260A Polishing machine Performing Operations; Transporting 8 Expired
US6214713A Two step cap nitride deposition for forming gate electrodes Emerging Cross-Sectional Technologies 6 Expired
US6211055A Wet-dry-wet process in wet station Emerging Cross-Sectional Technologies 6 Expired
US7087998B2 Control of air gap position in a dielectric layer Emerging Cross-Sectional Technologies 6 Expired
US6146987A Method for forming a contact plug over an underlying metal line using an etching stop layer Electricity 6 Expired
US6179915A On track coater unit cup set Emerging Cross-Sectional Technologies 4 Expired
US6187650A Method for improving global planarization uniformity of a silicon nitride layer used in the formation of trenches by using a sandwich stop layer Electricity 2 Expired
US6242137A Method to uni-directionally expand bandwidth of an asymmetric optical system Physics 1 Expired
US6194232A Multi-track wafer processing method Emerging Cross-Sectional Technologies 1 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.