Apparatus and method for use in manufacturing semiconductor devices
US6149048A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1998 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Apr 8, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.