Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same
US6153939A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1999 |
| Grant date | Nov 28, 2000 |
| Priority date | — |
| Expiry date | May 24, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip semiconductor device and a method for under filling the flip-chip semiconductor device are disclosed. The flip-chip semiconductor device is provided with a substrate and a die having a plurality of solder bumps for connecting to the substrate. Encapsulation material is under filled between the die and the substrate. The substrate has a non-mask area defied in a center portion thereof while the remaining surface area is covered by a solder mask. The non-mask area defines a hole in the center thereof so that the encapsulation material can be dispensed along all sides of the die to flow toward the non-mask area and stop when reaching the non-mask area whereby the encapsulation material does not block the hole and air between said die and the substrate is limited in a void formed around the hole and communicated with the atmosphere via the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.