Substrate processing system configurable for deposition or cleaning
US6159333A · kind A · utility
12Cited by
13References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 8, 1998 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Oct 8, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/916
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing substrates that is configured for a cleaning operation by loading a cleaning process wafer onto the susceptor before forming a cleaning plasma in the processing chamber. In one embodiment, a ceramic wafer is chosen to have a dielectric value sufficient to alter the electromagnetic field of the plasma, and spreads the plasma away from the susceptor during a cleaning operation, thus reducing damage to the susceptor. The plasma may be directed towards the walls of the chamber to reduce chamber cleaning time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.