Semiconductor processing using vapor mixtures
US6162734A · kind A · utility
9Cited by
1References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1999 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Jul 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Processing methods and systems using vapor phase processing streams made from a liquid phase source and feed gas. Some versions use multiple liquid sources and multiple vapor generators which each produce vapors which are mixed. Some of the vapor generators use metering pumps to inject a controlled flow of liquid into a controlled flow of feed gas. In some embodiments the vapors are exsiccated to reduce saturation before being introduced as a processing chamber vapor mixture into a processing chamber. The semiconductor pieces are preferably rotated within the processing chamber and can be processed in batches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.