Deposition of copper with increased adhesion
US6171661A · kind A · utility
299Cited by
16References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Feb 25, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for improving the adhesion of a copper layer to an underlying layer on a wafer. The layer of copper is formed over a layer of material on a wafer and the copper layer impacted with ions to improve its adhesion to the underlying layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.