Method and apparatus for plasma processing apparatus
US6172321A · kind A · utility
14Cited by
12References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1999 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Nov 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32678
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus and method of processing a specimen by a plasma. The method and apparatus includes independently controlling a density distribution of the plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.