Ken Yoshioka
79Patents
15h-index
97Co-inventors
87Inventor score
Filing activity: Jul 23, 1991 → Jan 2, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5855726A | Vacuum processing apparatus and semiconductor manufacturing line using the same | Emerging Cross-Sectional Technologies | 356 | Expired |
| US6245202A | Plasma treatment device | Electricity | 67 | Expired |
| US6646233B2 | Wafer stage for wafer processing apparatus and wafer processing method | Electricity | 57 | Expired |
| US5946184A | Electrostatic chuck, and method of and apparatus for processing sample | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6373681B1 | Electrostatic chuck, and method of and apparatus for processing sample using the chuck | Emerging Cross-Sectional Technologies | 36 | Expired |
| US7138606B2 | Wafer processing method | Electricity | 36 | Expired |
| US6180019A | Plasma processing apparatus and method | Electricity | 31 | Expired |
| US6388382B1 | Plasma processing apparatus and method | Electricity | 31 | Expired |
| US6243251A | Electrostatic chuck, and method of and apparatus for processing sample using the chuck | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6825617B2 | Semiconductor processing apparatus | Electricity | 28 | Expired |
| US6519504B1 | Vacuum processing apparatus and semiconductor manufacturing line using the same | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6895179B2 | Wafer stage for wafer processing apparatus | Electricity | 26 | Expired |
| US6833051B2 | Plasma processing apparatus and method | Electricity | 23 | Expired |
| US6756737B2 | Plasma processing apparatus and method | Electricity | 21 | Expired |
| US6837005B2 | Weatherstrip for automobile | Performing Operations; Transporting | 15 | Expired |
| US6172321A | Method and apparatus for plasma processing apparatus | Electricity | 14 | Expired |
| US6034346A | Method and apparatus for plasma processing apparatus | Electricity | 13 | Expired |
| US5874013A | Semiconductor integrated circuit arrangement fabrication method | Electricity | 13 | Expired |
| US6187874A | Adhesive for electronic parts and adhesive tape for electronic parts | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6430878B1 | Glass guide | Performing Operations; Transporting | 11 | Expired |
| US5343180A | Coil structure and coil container | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6499424B2 | Plasma processing apparatus and method | Electricity | 10 | Expired |
| US6596551B1 | Etching end point judging method, etching end point judging device, and insulating film etching method using these methods | Electricity | 10 | Expired |
| US7224568B2 | Plasma processing method and plasma processing apparatus | Electricity | 9 | Expired |
| US6549393B2 | Semiconductor wafer processing apparatus and method | Electricity | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.